Coreless: Building the Key
A next-generation substrate process built from zero — into the supply chain of one of the world's largest smartphone makers.
18SAMPLE BUILDS
2CERTIFICATIONS PASSED
8PATENTS FILED
01 Background
Around 2012, coreless packaging was the ticket into the newest products of one of the world's largest smartphone makers. Everyone in the industry wanted that order.
02 Challenge
A process nobody in the company had built before — and every competitor chasing the same certification.
03 Approach
Led a 14-person R&D team through design, sampling and qualification; filed eight patents along the way. 18 sample builds, 2 passed certification, 16 shipped step by step.
04 My role
R&D deputy manager — project lead, from blank process sheet to certified supplier.
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